Biography

Dr. Paul S. Ho is the Director of the Laboratory for Interconnect and Packaging at The University of Texas at Austin. He received his Ph.D. degree in physics from Rensselaer Polytechnic Institute. In 1991, he joined the faculty at The University of Texas at Austin and was appointed the Cockrell Family Regents Chair in Engineering. He has 20 years of industrial experience working at the IBM Thomas J. Watson Research Center, New York. His current research is in the area of materials, processing and reliability study for interconnect and packaging for microelectronics. He has published extensively and held 14 U.S. patents. He has received several awards and honors, including the Michel Lerme Award from the International Interconnect Technology Conference in 1999, the Thomas D. Callinan Award of the Dielectric Science and Technology Division of the Electrochemical Society in 2001, and the University Research Award from the Semiconductor Industry Association in 2007. He is a Fellow of the American Physical Society, the American Vacuum Society and the Institute of Electrical and Electronics Engineering.